High performance ceramic cooling tower fill system and retainers

ABSTRACT

High performance ceramic (“HPC”) cooling tower fill plates with scalloped top and bottom edges and cross-hatched veins are used in combination with improved retainers in order to produce high performance, cooling tower fill bundles.

This application is a continuation based upon and claims priority fromU.S. patent application Ser. No. 16/992,942, which is incorporatedherein by reference.

BACKGROUND OF THE INVENTION Field of the Invention

High performance ceramic (“HPC”) cooling tower fill combines thedurability of high quality ceramic materials with innovative designfeatures to produce a high performance, vertical flow heat transfermedia for use in counter-flow design water cooling towers.

Background Information

It is common to need to cool a building. This may be due to people ormachines inside the building. The heat may be from external sources,such as the sun, or internal sources such as server rooms that generateheat within the building. Regardless of the source, heat may need to bereduced. It is common to lower heat within a building using a coolingtower. It is also possible to use a refrigeration system, referred to asan HVAC. This invention is for use with a cooling tower for use incooling the building down.

The general functionality of a cooling tower is to circulate cool waterfrom the cooling tower to the building, where it acts as a heatsink—heat from the building is reduced by it warming the cool water. Thewarm water is then circulated back to the cooling tower where it iscooled and the pumped to the building again in a constant cycle.

Cooling tower systems are widely used to provide cooling in industrialand commercial applications such as building HVAC, cold storage, andindustrial cooling. Open recirculating cooling towers save tremendousamounts of energy and reduce greenhouse gas emissions compared to aircooled systems. The basic parts of such a cooling system are the coolingtower, a water pump, and a heat exchanger. There are one or more pipesthat carry warm water from the building and connect with piping in thecooling tower, at or near the top of the cooling tower. Likewise, thereare one or more pipes that carry cool water from piping in the coolingtower, at or near the bottom of the cooling tower, and connect to thebuilding. So, the water being supplied to the building comes from thelower pipes. It is desirable to supply the building with cold water.Warm water will be returned to the cooling tower because it will pick upsome of the heat out the building to carry the heat away. Then thecooling tower will get rid of that heat and once the heat is removed thethen cooled water can be sent back again to the building. The processwill continue in order that heat can continually be removed from thebuilding. Cooled water from the cooling tower is pumped through the heatexchanger in the building to be cooled and the cool water picks up heat.The now warm water is distributed over the top of a plurality of plates,the plurality of plates collectively called fill, in the tower.Relatively cool air moves past the warm water, cooling the water whichis then recirculated through the building in a cycle. The basin waterlevel drops due to these losses and more makeup water is added tomaintain level.

SUMMARY OF THE INVENTION

HPC is a combination splash/film fill that is available with a standardwetted surface area of 35.3 ft²/ft³. It has a high specific surfacearea.

HPC is durable and is unaffected by the harsh environments encounteredin cooling towers. Design and materials are ideally suited for operationwith poor water quality and long-term exposure to high/low operatingtemperatures.

200° F.+ Hot Water does not cause a problem for HPC.

Dirty Water does not cause a problem for HPC.

Salt or Brackish Water does not cause a problem for HPC.

Freeze-ups do not cause a problem for HPC.

HPC performs where other fill media cannot.

Plate type vertical flow media has amassed a proven reputation as alow-fouling, high performance fill with a very long life. HPC introducesceramic materials into this well-known vertical flow design to produce alow-fouling media with an expected service life of 50 years and more.

HPC performs similar to traditional cellular ceramic fill blocks;however, in a significantly reduced plan area and with less total fanhorsepower to result in valuable real estate and energy savings. Whencompared to cross-corrugated PVC film fill, HPC produces similarperformance without the thermal performance degradation that is normallyassociated with the high fouling rate and shorter useful operating lifeof PVC film fills.

Plate spacing for HPC can be readily varied for custom designconfigurations to address the dirtiest water applications.

HPC, in normal configuration, weighs about half that of traditionalcellular ceramic block fill, which results in lower structure, basin andfoundation costs.

Specification for Full Size Plates shown as one embodiment of theinvention.

300 mm×600 mm×4 mm Unglazed Tiles

1. Absorption (COMPLETE)

Specification: Water absorption shall be less than 1%. Prefer <0.01%.

Test Method: SCW.ACF.02.02 (COMPLETE)

2. Dimensional Tolerances

Width Specification: The width dimension shall be 300+/−5 mm

Length Specification: The length dimension shall be 600+/−5 mm

Thickness Specification: The web thickness shall be 4.5 mm+/−0.15 mm,while the cell thickness shall be 3.0 mm+/−0.1 mm

Test Method: SCWACF.01.02 (COMPLETE)

Warpage Specification: Plates will have a warpage tolerance of 1.5 mm

Test Method: SCWACF.03.02 (COMPLETE)

Modified version of Section 13 of ASTM C67

3. Weight: Full plates shall be weighed before measurement fordimensional tolerances. Weight Specification: Plates shall weigh lessthan 1.3 kilograms.

4. Physical Integrity Specification: The tile will be unglazed and firedto a fully vitrified body. Plates will be free of flaws that would causemechanical failure in direction of service. Blemishes and discolorationsare acceptable. Small pits, pocks and holes that do not extend more than⅓ of the way into the thickness of the plate and are less than 2 mm wideare acceptable. Deformations or other inconsistencies that do not effectflatness, or mechanical integrity are acceptable. Portions missing(chips) are unacceptable. All inconsistencies that adversely affect thestructural integrity of the plates are unacceptable.

5. Acid Solubility When Requested, Specification: Modified version ofSection 8 of ASTM C301 preparation from ASTM C980. Product will be usedin a water environment. Acid solubility will probably only need to beconducted on a yearly basis. Acid solubility testing may be necessary ona per job basis for unconventional applications. This will not be aresponsibility of the manufacturer unless there is an ongoing problemwith the materials.

6. Compressive Strength When Requested

Specification: The tile shall exhibit minimum compressive strength of2000 pounds per square inch over the gross nominal area in the directionof use in an assembled state.

Test Method: Compressive Strength testing following Section 6 of ASTMC67. Testing will be done in the assembled state and simulateapplication conditions.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration of a cooling tower in operativecommunication with a heat exchanger inside a building.

FIG. 2 is a side view of the interior of a cooling tower.

FIG. 3 is a cut-away perspective view of a cooling tower.

FIG. 4 is a side view of a portion of a fill bundle and retainer.

FIG. 5 is a perspective front view of a portion of a fill bundle andretainers.

FIG. 6A is a diagram illustrating the front dimensions of an embodimentof a plate.

FIG. 6B is a diagram illustrating the blown up portion, section A, ofthe plate of FIG. 6A.

FIG. 6C is a diagram illustrating the side dimensions of the plate ofFIG. 6A.

FIG. 7 is a perspective top view of a fill bundles and retainers.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Ref. Element Ref. Element Ref. Element 10 cooling 38 plate face 66retainer first tower 40 plate top arm 12 upper edge 68 retainer firstpipe 42 plate alpha slot 14 top pipe bottom 70 retainer first 16 bottomedge peak pipe 44 plate side 72 retainer second 18 lower edge arm pipe46 fill bundle 74 retainer second 20 pump layer alpha slot 22 interior48 vent 76 retainer second pipe 50 vein peak 24 building 52 port 78retainer third pipe 54 drift arm 26 heat eliminator 80 retainer secondexchanger 56 fan beta slot 28 piping 58 reservoir 82 retainer secondsystem 60 retainer end 30 sprayer 62 retainer 100 building 32 fill first102a water 34 plate end 102b warm water 36 fill 64 retainer 102c coolwater bundle first beta slot

Referring to the figures, FIGS. 1, 2, and 3 illustrate the function of acooling tower. FIG. 1 does not depict relative size. In order tofunction, warmed water 102 b from the building 100 runs through toppipes 14 and into upper pipes 12 to enter into the top, or near the top,of the cooling tower 10. The cooled water 102 c from the cooling tower10 exits the cooling tower 10 at the bottom, or near the bottom, of thecooling tower 10 through the bottom pipes 16 and into lower pipes 18into the building 100. One or more pumps 20 may be in operativecommunication with the top pipes 14, upper pipes 12, bottom pipes 16, orlower pipes 18 in order to cause, or help to cause, water to flowthrough the cooling system.

Thus, warmer water enters the cooling tower 10 through one or more upperpipes 12. The warmer water is distributed, or flows, through a pipingsystem 28. The piping system 28 distributes the warm water about theupper area of the cooling tower 10. Sprayers 30 are in operativecommunication with the piping system 28. The warm water moves throughthe piping system 28 and is sprinkled out of the sprayers 30.

Below the piping system 28 and the sprayers 30 is the fill 32. The fill32 is made up of a plurality of ceramic plates 34, and consists of aplurality of individual ceramic plates 34 which are arrayed in fillbundles 36 using retainers 60. Generally, a cooling tower 10 hasmultiple fill bundles 36 placed next to one another in a layer 46 offill bundles 36. And, multiple layers 46 stacked on top of one another.The fill bundles 36 hold the faces 66 of the individual plates 34generally vertically such that the water 102 a dropping down hits theplates 34 on the plate top edge 40 or on the plate face 38 near theplate top edge 40, and runs down the face 38 to the plate bottom edge42. Water 102 a is sprayed over the top layer 46, and the water 102 aruns down the plate faces 38 of the bundles 36 and layers 46.

The plates 34 are generally rectangular, having a top edge 40, two (2)opposing side edges 44, and a bottom edge 42 opposite the top edge 40.The top 40, side 44, and bottom 42 edges bound two (2) faces 38. Theedges (40, 42, and 44) may be linear but may also be curved, angled, orscalloped. Consequently, the faces 38 are generally planar, but may notbe absolutely planar, and are not necessarily planar. Therefore, herein,reference to a face 38 being “planar” does not mean that the face 38 isabsolutely flat, because while it can be flat, it may also be angled orcurved.

In order to cool the warm water 102 b, the warm water 102 b sprays ontothe fill 32 and plates 34. The water 102 a on the fill plates 34trickles down into the gaps between the plates 34. The water 102 a dropsform a film or thin layer of water 102 a on the plate 34 and the water102 a tends to run down the faces 38. The plate 34 acts as a heatexchanger because the drops of water 102 a forms a film of water 102 aon the face 38. The area of the faces 38 is relatively large to thethickness of the film of water 102 a. The cooling tower 10 actually hastwo ways of cooling. The first is that the water 102 b sprays out of thesprayer 30 and lands on the plate 34 (which is effectively a heatexchanger), the air then comes in contact with the water 102 b and takesthe heat away. The second mechanism is that some of that water 102 bwill also evaporate and that also creates an additional cooling effect.

In order to get rid of the heat that the warm water 102 b contains, airis drawn in from air outside of the cooling tower 10 through vents 48generally near the bottom of the cooling tower 10. The air moves upthrough the layers 46 of fill 32 to the top or near the top of thecooling tower 10 where it exits the cooling tower 10 through ports 52.

Generally near the top of the cooling tower 10 is a fan 56, or fans 56.The fan 56 is positioned so as to pull air upward from the bottom of thecooling tower 10 and push the air out of the cooling tower 10 at or nearthe top. This type of cooling tower 10 is called an “induced mechanicaldraft cooling tower.” If the fan 56 was installed at the bottom of thecooling tower 10 and pushed the air up through the fill 32, then it iscalled a “forced mechanical draft cooling tower.” There are other typesand mechanisms for cooling towers 10, but all work generally thesame—air traveling across the wet plates 34 in order to cool the warmwater 102 b —even though they may have different embodiments.

Between the fill 32 and the ports 52 (in addition to the piping system28 and sprayers 30), the cooling tower 10 may have drift eliminators 54.There is a loss of water 102 a to the environment due to the evaporativecooling process. A drift eliminator 54 is designed to capture largewater droplets caught in the cooling tower 10 air stream. The drifteliminator 54 helps prevent the water 102 a droplets and mist fromescaping the cooling tower 10.

Because of the shape of the plate face 38, the water 102 b is spread outover a very large cross-sectional area. Thus, the warm water 102 b iscoming into contact with the air. The air is relatively cooler than thewarm water 102 b. The large face 38 area in contact with the thin filmof warm water 102 b causes a large heat transfer rate. The air takesaway as much heat as possible in as short amount of time as possible,and the warm water 102 b is cooled, becoming cool water 102 c. Thus, asair exits the fill 32, it is warmer. Conversely, as the water 102 aexits the bottom of the fill 32, it is cooler. The cool water 102 c thendrops off of the fill 32 and into a reservoir 58. The cool water 102 cthen can exit the cooling tower 10 through the bottom pipes 16 and on tothe building 100 through the lower pipes 18. Water 102 c flow may behelped by pumps 20. Once in the building 100, the cool water 102 c flowsthrough interior pipe 22 and through a heat exchanger 26 where the coolwater 102 c cools the air for distribution through in the building andthe consequently warmed water 102 b begins the process again.

FIG. 4 shows side view of a portion of a fill bundle 36 and retainer 60.The fill bundle 36 is made up of a multiplicity of plates 34 which areheld in place by a retainer 60. The retainers 60 hold the plates 34upright and separated from each other. The retainer 60 may be generallydescribed as “S” shaped. The upper, alpha portion of the retainer 34 ismirrored by the lower, beta portion of the retainer 34. The retainer 34from top to bottom is comprised of a first end 62 connected to a firstarm 66. The first arm 66 is angled outwardly between the first end 62and a first peak 70. A second arm 72 angles inwardly from the first peak72 to a second peak 76. A third arm 78 is angled inwardly between thesecond peak 76 and a second end 82. The first end 62 and the second end82 face in opposite directions from each other. Likewise, the first peak70 and the second peak 76 extend in opposite directions from each other.

There are four (4) sets of slots designed to retain the plates 34. Thefirst beta slot 64 is an opening that extends between the retainer firstend 62 and the first arm 66. Along the retainer 60, there are amultiplicity of first beta slots 64. The first alpha slot 68 is anopening that extends between the first arm 66, the first peak 70, andthe second arm 72. Along the retainer 60, there are a multiplicity offirst alpha slots 68. The second alpha slot 74 is an opening thatextends between the second arm 72, the second peak 76, and the third arm78. Along the retainer 60, there are a multiplicity of second alphaslots 74. The second beta slot 80 is an opening that extends between thethird arm 78 and the second end 82. Along the retainer 60, there are amultiplicity of second beta slots 80.

The first beta slot 64 is in line with the second alpha slot 74, suchthat a plate 34-1 may be inserted into both the first beta slot 64 andthe second alpha slot 74, and held generally upright. Likewise, thefirst alpha slot 68 is in line with the second beta slot 80, such that aplate 34-2 may be inserted into both the first alpha slot 68 and thesecond beta slot 80, and held generally upright. The first beta slot 64and the second alpha slot 74 combination is offset from the first alphaslot 68 and the second beta slot 80 combination. This allows theretainer 60 to hold a first multiplicity of plates 34 on a first sideand a second multiplicity of plates 34 opposite the first multiplicityof plates on a second side. Each of the slots 64, 68, 74, and 80, aresized in width to be just larger than the width of the plates 34 suchthat a plate 34-1 may be urged into the first beta slot 64 and thesecond alpha slot 74 combination and a plate 34-2 may be urged into thefirst alpha slot 68 and the second beta slot 80 combination. Becausethere are a multiplicity of these slot combinations along the length ofthe retainer 60, the retainer 60 can hold a multiplicity of plates 34 inan upright position on the retainer's 60 first and second sides.

FIG. 5 is a perspective front view of a portion of a fill bundle 36 andretainers 60. This figure illustrates a fill bundle 36 inserted into afirst side of a retainer 60-1 and a second side of a retainer 60-2. Anend of the retainer 60-1 shows the first end 62 extending over a sideedge 44 of plate 34-1. Likewise, second peak 76 extends over side edge44 of plate 34-1. Plate 34-1 is inserted and urged into first beta slot64 and second alpha slot 74. Conversely, first peak 70, first alpha slot68, second beta slot 80 and second end 82 extend away from plate 34-1.

The fill plates 34 are made of ceramic, or the HPC. The fill plate 34has a top edge 40 opposite a bottom edge 42, end a first side edge 44-1opposite a second side edge 44-2. The top edge 40, bottom edge 42, firstside edge 44-1, and the second side edge 44-2 outline, or define, afirst face 38-1 and an opposing, or backing, second face 38-2. Theplates 34 feature scalloped top and bottom edges (40 and 42) whichreduce flow restrictions between layers. The ribbed surface pattern ofveins 50 on the faces (38-1 and 38-2) of the fill plate 34 may becross-hatched and promotes uniform water distribution over the faces(38-1 and 38-2) of the fill plate 34. The veins 50 increase water dwelltime and increases airflow turbulence. All of these attributes increaseheat transfer between the air and the warm water 102 b on the faces(38-1 and 38-2) of the fill plate 34. It is expected that the plates 34will be made of HPC as described herein. The scalloped top and bottomedges (40 and 42) may be offset in adjoining plates 34. The portion ofthe top edge 40 that is at the lower portion of the scallop and theportion of the veins connected to it, form a triangle.

FIGS. 6A. 6B, and 6C are diagrams illustrating dimensions of anembodiment of a plate 34. It is anticipated that each of the dimensionsmay be plus or minus two (2) mm. It is also anticipated that larger orsmaller plates 34 may be used that employ dimensions that are greater orlarger, but scaled from the listed dimensions. The top and bottom (40and 42) and the first and second side (44-1 and 44-2) edges, as well asthe veins 50, are thicker than the remainder of the fill plate 34, fromfront face 38-1 to back face 38-2. In an embodiment illustrated in FIG.6C, the edges (40, 42, 44-1, and 44-2) and veins 50 are about 84%thicker than the remainder of the fill plate 34.

FIG. 7 is a perspective top view of a fill bundles 36 with their plates34 and retainers 60. The multiplicity of plates 34 and their top edges40 are shown with retainer 60 urged on to the multiplicity of plate sideedges 44. The scalloped top and bottom edges (40 and 42) are offset inadjoining plates (i.e. plates that are next to each other).

The retainers 60 allow for easier installation and repair of fillbundles 36. Conventional technology requires multiple copper tubes, witheach copper tube “crimped” at each plate to provide the uniform plate 34spacing. This spacing method is disadvantageous due to “racking andmisalignment” of the plates over time. Further, the conventionaltechnology requires that if a single plate needs to be replaced, theentire fill bundle 36 must be removed due to the continuous multiplecrimped copper tubes that act as the uniform spacers for an entireassembled unit bundle. The retainer 60 eliminate the “racking andmisalignment” possibilities, and very importantly allow for removal ofsingle ceramic plates in a “fill bundle” without disturbing adjacentplates. Entire fill bundle replacement is eliminated. The retainer 60design preserves the original plate 34 spacing to maintain the originalthermal performance, if plate 34 removal is ever required over time.Thus, the overall plate bundle integrity for continued “original”thermal performance capability is preserved.

Additionally, the offset, scalloped plates 34 provide for an “egg crate”installation. Above and below the fill bundle 36, the top edges 40 andbottom edges 42 are a part of the thermal design and act as an “air andwater balancing plate” at the top and bottom of the fill bundle 36.Additionally, the “egg crate” thermal design provides protection frommaintenance foot traffic on the top surface of the fill 32.

Unless otherwise specifically noted, articles depicted in the drawingsare not necessarily drawn to scale, however the drawings do depictrelative size and placement.

Throughout this disclosure, a hyphenated form of a reference numeralrefers to a specific instance of an element and the un-hyphenated formof the reference numeral refers to the element generically orcollectively. Thus for example, widget 12-1 would refer to a specificwidget of a widget class 12, while the class of widgets may be referredto collectively as widgets 12 and any one of which may be referred togenerically as a widget 12.

It should be noted that when “about” or “approximately” is providedherein at the beginning of a numerical list, the term modifies eachnumber of the numerical list. In some numerical listings of ranges, somelower limits listed may be greater than some upper limits listed. Oneskilled in the art will recognize that the selected subset will requirethe selection of an upper limit in excess of the selected lower limit.Unless otherwise indicated, all numbers expressing quantities and thelike used in the present specification and associated claims are to beunderstood as being modified in all instances by the terms “about” or“approximately.” As used herein, the term “approximately” encompasses+/−5% of each numerical value. For example, if the numerical value is“approximately 80%,” then it can be 80% +/−5%, equivalent to 75% to 85%.Accordingly, unless indicated to the contrary, the numerical parametersset forth in the following specification and attached claims areapproximations that may vary depending upon the desired propertiessought to be obtained by the exemplary embodiments described herein. Atthe very least, and not as an attempt to limit the application of thedoctrine of equivalents to the scope of the claim, each numericalparameter should at least be construed in light of the number ofreported significant digits and by applying ordinary roundingtechniques.

The term “about” is defined as being close to as understood by one ofordinary skill in the art, and in one non-limiting embodiment the termsare defined to be within 10%.

The term “substantially” and its variations are defined as being largelybut not necessarily wholly what is specified as understood by one ofordinary skill in the art, and in one non-limiting embodimentsubstantially refers to ranges within 1%.

The terms “inhibiting” or “reducing” or any variation of these termsrefer to any measurable decrease, or complete inhibition, of a desiredresult. The terms “promote” or “increase” or any variation of theseterms includes any measurable increase, or completion, of a desiredresult.

The term “effective,” as that term is used in the specification and/orclaims, means adequate to accomplish a desired, expected, or intendedresult.

The terms “a” or “an” when used in conjunction with the term“comprising” in the claims and/or the specification may mean “one,” butit is also consistent with the meaning of “one or more,” “at least one,”and “one or more than one.”

The term “each” refers to each member of a set, or each member of asubset of a set.

The terms “comprising” (and any form of comprising, such as “comprise”and “comprises”), “having” (and any form of having, such as “have” and“has”), “including” (and any form of including, such as “includes” and“include”) or “containing” (and any form of containing, such as“contains” and “contain”) are inclusive or open-ended and do not excludeadditional, unrecited elements or method steps.

In interpreting the claims appended hereto, it is not intended that anyof the appended claims or claim elements invoke 35 U.S.C. 112(f) unlessthe words “means for” or “step for” are explicitly used in theparticular claim.

It should be understood that, although exemplary embodiments areillustrated in the figures and description, the principles of thepresent disclosure may be implemented using any number of techniques,whether currently known or not. The present disclosure should in no waybe limited to the exemplary implementations and techniques illustratedin the drawings and description herein. Thus, although the invention hasbeen described with reference to specific embodiments, this descriptionis not meant to be construed in a limited sense. Various embodiments mayinclude some, none, or all of the enumerated advantages. Variousmodifications of the disclosed embodiments, as well as alternativeembodiments of the inventions will become apparent to persons skilled inthe art upon the reference to the description of the invention. It is,therefore, contemplated that the appended claims will cover suchmodifications that fall within the scope of the invention.Modifications, additions, or omissions may be made to the systems,apparatuses, and methods described herein without departing from thescope of the disclosure. For example, the operations of the systems andapparatuses disclosed herein may be performed by more, fewer, or othercomponents in the methods described may include more, fewer, or othersteps. Additionally, steps may be performed in any suitable order.

I claim:
 1. Fill bundles for use in cooling towers comprising: a fillplate, wherein said fill plate is made of ceramic; wherein said fillplate has a top edge opposite a bottom edge, end a first side edgeopposite a second side edge, and said top edge, bottom edge, first sideedge, and said second side edge define a first face and an opposingsecond face; wherein said top edge is scalloped; a crosshatch of veinson said first face and said second face; and wherein said crosshatch ofveins are in a diamond pattern when said fill plate is held generallyupright.
 2. The apparatus of claim 1, wherein said top and bottom edges,and said first and second side edges, and said veins 50, are thickerthan the remainder of said fill plate.
 3. The apparatus of claim 2,wherein said top and bottom edges, and said first and second side edges,and said veins 50, are about 84% thicker than the remainder of said fillplate.
 4. The apparatus of claim 2, wherein a portion of said top edgethat is at the lower portion of said top edge scallop and a portion ofsaid veins connected to it, form a triangle.
 5. The apparatus of claim2, further comprising: a multiplicity of said fill plates; and whereinsaid multiplicity of said fill plates is held as a fill bundle.
 6. Theapparatus of claim 2, further comprising: wherein said multiplicity ofsaid fill plates in said fill bundle are held generally upright.
 7. Theapparatus of claim 2, wherein scalloped top and bottom edges (40 and 42)are offset in adjoining plates in said fill bundle.
 8. The apparatus ofclaim 6, wherein scalloped top and bottom edges (40 and 42) are offsetin adjoining plates in said fill bundle.
 9. The apparatus of claim 3,further comprising: a multiplicity of said fill plates; and wherein saidmultiplicity of said fill plates is held as a fill bundle.
 10. Theapparatus of claim 9, further comprising: wherein said multiplicity ofsaid fill plates in said fill bundle are held generally upright.
 11. Theapparatus of claim 9, wherein scalloped top and bottom edges (40 and 42)are offset in adjoining plates in said fill bundle.
 12. The apparatus ofclaim 10, wherein scalloped top and bottom edges (40 and 42) are offsetin adjoining plates in said fill bundle.